Could I help you?
> IEC 60191-6-6 Ed. 1.0 b:2001
New Sale! View larger

IEC 60191-6-6 Ed. 1.0 b:2001

New product

IEC 60191-6-6 Ed. 1.0 b:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

standard by International Electrotechnical Commission, 03/22/2001

More details

$36.08

-56%

$82.00

More info

Full Description

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Product Details

Edition: 1.0 Published: 03/22/2001 Number of Pages: 25File Size: 1 file , 310 KB