IEC 60191-6-6 Ed. 1.0 en:2001

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IEC 60191-6-6 Ed. 1.0 en:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

standard by International Electrotechnical Commission, 03/22/2001

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Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

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Edition: 1.0 Published: 03/22/2001 Number of Pages: 12File Size: 1 file , 120 KB