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IEC 60191-6-2 Ed. 1.0 b:2001

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IEC 60191-6-2 Ed. 1.0 b:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

standard by International Electrotechnical Commission, 12/11/2001

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IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

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Edition: 1.0 Published: 12/11/2001 Number of Pages: 21File Size: 1 file , 250 KB