Full Description

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Product Details

Edition: 1.0 Published: 03/14/2003 Number of Pages: 127File Size: 1 file , 5.8 MB